IPC-7351B Naming Convention for Small Outline No-Lead with Thermal Pad SON

SON + Pitch + P + Body Width X Body Length X Height – Pin Qty + Thermal Pad

Example:

SON50P200X300X80-11N_JEDEC_MO-229WECD-2_Linear-DDB

SON – Thermally Enhanced Plastic Small Outline No-Lead
50 – Pitch = 0.50mm
200 – Body Width = 2.00mm
300 – Body Length = 3.00mm
80 – Height = 0.80mm
11 Pin Qty = 11 (10 Pins + 1 Thermal Pad)
JEDEC_MO-229WECD-2 – Standard Package Name (Added by PCB-3D.com)
Linear – Manufacturer Name (Added by PCB-3D.com)
DDB – Manufacturer Code, Package Name or Package Code (Added by PCB-3D.com)

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