Abbreviations in Electrical & Electronics Engineering

16QAM (16-state quadrature amplitude modulation)
64QAM (64-state quadrature amplitude modulation)
8DPSK (8-state differential phase shift keying)
A (Ampere, Amp)
A/D (Analog to Digital)
AC (Alternating current)
AC/DC (Alternating current or direct current)
ADC (Analog to digital converter)
AES Advanced Encryption Standard
AFC (Automatic Flow Controller)
AFC (Automatic Frequency Control)
AFT (Automatic fine tunung)
AGC (Automatic gain control)
AI (Analog Input)
AMOLED (Active-Matrix Organic Light-Emitting Diode)
ANSI (the U.S. American National Standards Institute)
AO (Analog Output)
AoA (Angle of arrival)
AP (Access Point)
API (Application Programming Interface)
ARM (Advanced Reduced instruction set computing Machine)
ASP (Application Service Provider)
AT ( AT Attachment)
ATAPI (AT Attachment Packet Interface)
AV (Audio/video)
AVDD (Analog Power)
BER (Bit error rate)
BGA (Ball Grid Array)
BiCMOS (Bidirectional CMOS)
BLE (Bluetooth Low Energy)
BOM (Bill Of Materials)
CA (Conditional Access)
CAD (Computer-Aided Design)
CAM (Conditional Access Module)
CAPAD (Capacitors Non Polarized Axial Diameter Horizontal Mounting)
CAPADV (Capacitors Non Polarized Axial Diameter Vertical Mounting)
CAPAE (Capacitor Aluminum Electrolytic)
CAPAR (Capacitors Non Polarized Axial Rectangular)
CAPARV (Capacitors Non Polarized Axial Rect. Vertical Mounting)
CAPC (Capacitor Chip Non-polarized)
CAPCAF (Capacitor Chip Array Flat)
CAPCAV (Capacitor Chip Array Concave)
CAPCP (Capacitor Chip Polarized)
CAPCWR (Capacitor Chip Wire Rectangle)
CAPM (Capacitor Molded Non-polarized)
CAPMP (Capacitor Molded Polarized)
CAPPA (Capacitors Polarized Axial Diameter Horizontal Mounting)
CAPPRD Capacitors Polarized Radial Diameter
CAPRB Capacitors Non Polarized Radial Disk Button Vertical
CAPRD (Capacitors Non Polarized Radial Diameter)
CAPRR Capacitors Non Polarized Radial Rectangular Vertical
CAS (Conditional Access System)
CBC (Cipher Block Chaining mode)
CC (Cable Card)
CCIPCA (Candid CovarianceFree Incremental Principal Component Analysis )
CFP (Ceramic Flat Package)
CI (Common Interface protocol)
CIS (Component Information System)
CLK (Clock)
CLKOUT (Clock Output)
CM (Multimedia Codec Manager)
CMOS (Complementary Metal – Oxide Semiconductor)
CQFP (Ceramic Quad Flat Packages)
CS (Chip Select)
CSA (Common Scrambling Algorithm)
CSL (Coordinated Sample Listing)
CVBS (Color Video Blanking and Sync)
D/A (Digital to Analog)
DAC (Digital to Analog Converter)
DBS (Dual-band simultaneous)
DDR (Double Data RAM)
DDR (Double Data Rate)
DES (Data Encryption Standard)
DFHP (Device-Free Human Presence)
DFN (Dual Flat No-lead)
DI (Digital Input)
DIOAD (Diodes Axial Diameter Horizontal)
DIOADV (Diodes Axial Diameter Vertical)
DIOC (Diode Chip)
DIOM (Diode Molded)
DIOMELF (Diode metal electrode leadless face melf)
DIOSC (Diode Side Concave)
DIP (Dual-in-Line Package)
DIPS (Dual-In-Line Sockets)
DK (Development Kit)
DMA (Direct Memory Access)
DNC (Do Not Connect)
DO (Digital Output)
DRAM (Dynamic Random Access Memory)
DRM (Digital Rights Management)
DSL (Digital Subscriber Line)
DSP (Digital signal processor)
DTCP-IP (Digital Transmission Content Protection over Internet Protocol)
DTE (Data Terminal Equipment)
DTV (Digital TeleVision)
DVB (Digital Video Broadcasting)
DVB-C (Digital Video Broadcasting – Cable)
DVB-S (Digital Video Broadcasting – Satellite)
DVB-S2 (Digital Video Broadcasting – Satellite Second Generation)
DVB-T (Digital Video Broadcasting – Terrestrial)
DVB-T2 (Digital Video Broadcasting – Second Generation Terrestrial)
DVDD (Digital Power)
E2LP (Embedded Engineering Learning Platform)
ECAD (Electronic Computer-Aided Design)
ECB (Electronic Codebook mode)
ECM (Entitlement Control Management)
EDA (Electronic Design Automation)
EDR (Enhanced data rate)
EIA (Electronic Industries Alliance)
Electrolytic Ni /Au (Electrolytic Nickel / Gold)
EMI (Electromagnetic interference)
EMM (Entitlement Management Message)
eMMC (Embedded Multimedia Card)
ENIG (Electroless Nickel-Immersion Gold)
ENIP (Electroless Nickel-Immersion Palladium)
ESR (Equivalent Series Resistance)
ETH (Ethernet)
ETSI (European Telecommunications Standards Institute)
EVM (Error Vector Magnitude)
FIFO (First In First Out)
FMC (FPGA Mezzanine Card)
FPGA (Field-Programmable Gate Array)
FUSM (Fuse Molded)
GND (Ground)
GPIO (General Purpose Input Output)
GUI (Graphic User Interface)
HAL (Hardware Abstraction Layer)
HASL (Hot Air Solder Level)
HD (High Definition)
HDMI (High-Definition Multimedia Interface)
HDR (Header)
HDRRA (Header Right Angle)
HDRV (Header Vertical)
HDTV (High Definition TV)
HPC (High Pin Count)
HS (High Speed)
HSDPA (High Speed Downlink Packet Access)
HSIC (High Speed Inter Chip)
HSUPA (High Speed Uplink Packet Access)
I/O (Input Output)
I2C (Inter-Integrated Circuit)
I2S (Inter-IC Sound)
IC (Integrated Cicuit)
IDE (Integrated Drive Electronics)
IEEE (Institute of Electrical and Electronics Engineers)
Imm Ag (Immersion Silver)
Imm Sn (Immersion Tin)
INDAD (Inductor Axial Diameter Horizontal Mounting)
INDADV (Inductor Axial Diameter Vertical Mounting)
INDC (Inductor Chip)
INDCAF (Inductor Chip Array Flat)
INDCAV (Inductor Chip Array Concave)
INDM (Inductor Molded)
INDP (Inductor Precision Wire Wound)
INDRD (Inductors Radial Diameter)
IoE (Internet of Everything)
IoT (Internet of Things)
IP (Intellectual Property)
IP (Internet Protocol)
IPC (Interconnecting and packaging electronic Circuit)
IR (Infra Red)
ISP (Internet service provider)
JESD (JEDEC standards)
JTAG (Joint Test Action Group)
JUMP (Jumper)
kbps (kilobits per second)
LCC (Quad Leadless Ceramic Chip Carrier)
LCCS (Quad Leadless Ceramic Chip Carrier)
LCD (Liquid-crystal display)
LCM (Lighting Connectivity Module)
LED (Light-emiting diode)
LEDM (LED Molded)
LEDSC (LED Side Concave)
LGA (Land Grid Array)
LPC (Low Pin Count)
LPCM (Linear pulse-code modulation)
LPRF (Low Power RF)
LTE (Long-Term Evolution)
M2M (Machine to Machine)
MCAD (Mechanical Computer-Aided Design)
MDIO (Management Data Input Output)
MIB (Management Information Base)
MICTOS (MICronas TV Operating System)
MII (Media Indenpendet Interface)
MISO (Master Input Slave Output)
MMC (MultiMediaCard)
MMP (MultiMedia Player)
MMU (Memory Management Unit)
MOSI (Master Output Slave Input)
MPEG (Motion Picture Experts Group)
MRDY (Master Ready)
MSD (Mass Storage Device)
MSL (Moisture Sensitivity Level)
NA (Network Analyzer)
Nagra PRM (Nagra Media Persistent Rights Management)
NC (No Connection)
NIM (Network Interface Module)
NPTH (Non Plated Through Hole)
NTSC (National Television System Committee)
OD (Open Drain)
OD (Outside Diameter)
OEM (Original Equipment Manufacturer)
OMAC (One-key Message Authentication Code)
OS (Operating System)
OSC (Oscillator)
OSCCC (Oscillator Corner Concave)
OSCJ (Oscillator J-Lead)
OSCL (Oscillator L-Bend Lead)
OSCSC (Oscillator Side Concave)
OSP (Organic Solderability Preservative)
OTG (On-The-Go)
PA (Power amplifier)
PADS (Personal Automated Design System)
PAL (Phase Alternating Line)
PAL (Programmable Array Logic)
PATA (Parallel ATA)
PBL (Primary Boot Load)
PCB (Printed Circuit Board)
PCMCIA (Personal Computer Memory Card International Association)
PDET (Power detector)
PGA (Pin Grid Array)
PID (Packet Identifier)
PIR (Passive Infrared Sensors)
PLCC (Plastic Leaded Chip Carrier)
PLCCS (Plastic Leaded Chip Carrier Socket Square)
PM (Power management)
PMIC (Power management integrated circuit)
PQFN (Pull-back Quad Flat No-lead)
PS (Power Supply)
PSON (Pull-back Small Outline No-lead)
PTH (Plated Through Hole)
PVR (Personal video recorder)
PWM (Pulse Width Modulation)
PWR (Power)
QFN (Quad Flat No-lead)
QFP (Quad Flat Package)
RAM (Random-Access Memory)
RAM (Read-Only Memory)
RCA (Radio Corporation of America)
RDBS (Radio Broadcast Data System)
RDS (Radio Data System)
RESAD (Resistor Axial Diameter Horizontal Mounting)
RESADV (Resistor Axial Diameter Vertical Mounting )
RESAR (Resistor Axial Rectangular Horizontal Mounting)
RESC (Resistor Chip)
RESCAF (Resistor Chip Array Flat)
RESCAXE (Resistor Chip Array Convex E-Version (Even Pin Size))
RESCAXS (Resistor Chip Array Convex S-Version (Side Pins Diff))
RESM (Resistor Molded)
RGMII (Reduced Gigabit Ethernet Media Independent Interface)
RH (Relative humidity)
RISC (Reduced Instruction Set Computer)
RoHS (Restriction of Hazardous Substances)
RSSI (Received Signal Strength indicator)
RTC (Real Time Clock)
RTOS (Real-Time Operating System)
S2E (Serial-to-Ethernet)
SATA (Serial ATA)
SC (Smart Card)
SCL (System Control Layer)
SCTE Society of Cable Telecommunications Engineers
SD (Secure Digital)
SD (Standard definition)
SDRAM (Synchronous Dynamic Random-Access Memory)
SDT (Schematic Design Tools)
SDTV (Standard Definition Television)
SECAM (Séquentiel Couleur Avec Mémoire (French Color TV Standard))
SenML (Sensor Markup Language)
SFS (Streaming File System)
SIM (Subscriber Identification Module)
SIP (Single-In-Line Package)
SMSC (Standard Microsystems Corporation)
SMT (Surface mount technology)
SnPb (Tin-Lead (for solder))
SoC (System on Chip)
SOD (Small Outline Diode)
SODFL (Small Outline Diode Flat Lead)
SOIC (Small Outline Integrated Circuit)
SOJ (Small Outline IC J-Leaded)
SON (Small Outline No-lead)
SOP (Small Outline Package)
SOTFL (Small Outline Transistor Flat Lead)
SPI (Serial Peripheral Interface)
SQFP (Shrink Quad Flat Packages)
SRDY (Slave Ready)
SRO (Solder resistant opening)
SSOP (Shrink Small Outline Package)
SSR (Solid State Relay)
SSS (Selective Solder Strip)
SSTL (Stub Series Terminated Logic)
STB (Set Top Box)
TCP (Transmission Control Protocol)
TCP/IP (Transmission Control Protocol/Internet Protocol)
TDES (Triple Data Encryption Standard)
TI (Texas Instruments)
TP (Test Point)
TQFP (Thin Quad Flat Package)
TRNG (True Random Number Generator)
TS Transport Stream
TS (Transport Stream)
TSOP (Thin Small Outline Package)
TSQFP (Thin Shrink Quad Flat Packages)
TSSOP (Thin Shrink Small Outline Package)
TTSC (Telit Technical Support Centre)
UART (Universal Asynchronous Receiver/Transmitter)
ULPI (Utmi+ Low Pin Interface)
UMTS (Universal Mobile Telecommunication System)
UPnP (Universal Plug and Play)
USB (Universal Serial Bus)
VBATT (Battery Power Supply)
VGA (Video Graphics Array)
VNA (Vector Network Analyzer)
VSWR (Voltage Standing Wave Ratio)
WAN (Wide Area Networks)
WCDMA (Wideband Code Division Multiple Access)
Wi-Fi (Wireless Internet Free Internet)
WLAN (Wireless Local Area Network)
WLPSP Wafer Level Pico Scale Package
WPS (Wi-Fi Protected Setup)
WSI (WLAN to Serial interface)
xSP (Hosted Service Provider)
XTAL (Crystal)
Z (Impedance)
ZIF (Zero Insertion Force)