Shipment and handling package types

List of methods for shipment and handling packages of surface mount devices (SMD) and some through-hole devices (THD) are:

Tape and Reel

The most used method for shipment and handling SMD packages is Tape and Reel.It is used for shipment of almost all SMD packages such as: CHIP, BGA, SOIC, SOP, QFN , QFP, SOT etc.

Standard Tape and Reel width Dimensions are 8mm, 12mm, 16mm, 24mm, 32mm, 44m, 56mm.

Standard Tape and Reel Diameter (Size) Dimensions are 178mm (7 inches), 330mm (13 inches), 360mm (14.173 inches).

tape_and_reel_package_of_electronic_components

Picture 1: Tape and Reel Package

Tube

Tubes (also called stick magazines) are one of the first types of shipment packages. They are used for both SMD and THD components.

tube_package_of_electronic_components

Picture 2: Tube Package

Tray

Trays are used for shipment and handling SMD packages. Tray’s advantage in regards to tube packages is that they protect balls and leads from mechanical and electrical damage.

Standard Tray Dimension by JEDEC is 322.6 x 136mm (12.7 x 5.35 inches)

There are 2 standard JEDEC tray thicknesses:

1. Low profile of 6.35mm (0.25 inch) suitable for BGA, CSP, QFP, TQFP, SQFP, TSQFP, QFN, SOP, TSOP, TSSOP and SOIC

2. High profile of 10.16mm (0.4 inch) suitable for CERAMIC QUAD, PGA, and PLCC

tray_package_of_electronic_components

Picture 3: Tray Package

Bulk

It is widely used for some through-hole components.

bulk_package_of_electronic_components

Picture 4: Bulk Package

Die and Wafer

Wafer is a slice of semiconductor material, such as silicon crystal. It is used for production of semiconductor devices and integrated circuits.

die_and_wafer

Picture 3: Die and Wafer

Useful links of Tape and Reel Specifications by Manufacturers

Useful links of Tape and Reel Specifications by Manufacturers are listed below:

Analog Devices

On Semiconductor

Vishay

Wurth

Freescale

Microchip

Intersil

Supertex Inc.

Linear Technology

Texas Instrumetns

Spansion

Useful links of Packing Methodology

Useful links of Packing Methodology published by:

Texas Instrumetns