Download 3D STEP Model - BGA900C80P30X30_2500X2500X355_TI_FCBGA_CMS_S-PBGA-N900

3D STEP Models in Mount Type: Surface Mount
3D STEP Models in Electric Type: Ball Grid Arrays BGA
3D STEP Models in Manufacturer: Texas Instruments
3D STEP Models in Membership Type: Membership

Package Description:

Description: BGA Package 25mm X 25mm; 900-Pin Flip-Chip Plastic ball grid array package BGA (CMS); Package identifier: CMS-03; Part No.: 66AK2L06

IPC-7351 Naming Convention for Ball Grid Array’s (BGA)

BGA – Ball Grid Array’s
BGA + Pin Qty + C or N + Pitch P + Ball Columns X Ball Rows _Body Length X Body Width X Height
BGA – Ball Grid Array’s w/Dual Pitch
BGA + Pin Qty + C or N + Colum Pitch X Row Pitch P + Ball Columns X Ball Rows _Body Length X Body Width X Height
BGAS – Ball Grid Array’s w/Staggered Pins
BGAS + Pin Qty + C or N + Pitch P + Ball Columns X Ball Rows _Body Length X Body Width X Height

Example:

BGA63C80P10X12_900X1100X100_VFBGA_63
BGA = Ball Grid Array’s, Surface mount package
63 – Pin Qty = 63
80P – Pitch = 0.8mm
10 – Ball Columns = 10
12 – Ball Rows = 12
900 – Body Length = 9.00mm
1100 – Body Width = 11.00mm
100 – Component Height (Body Height) = 1.00mm
VFBGA_63 – Manufacturer Code/Manufacturer Series (Added by PCB-3D.com)

Datasheet or Drawing

File Name: BGA900C80P30X30_2500X2500X355_TI_FCBGA_CMS_S-PBGA-N900.pdf
File Format: pdf

3D CAD Model - STEP

File Name: BGA900C80P30X30_2500X2500X355_TI_FCBGA_CMS_S-PBGA-N900
File Format: STEP

Altium Designer - Footprint

File Name:
File Type: PCB Library (Footprint)
File Format: PcbLib

Altium Designer - Schematic Symbol

File Name:
File Type: Schematic Library (Schematic Symbol)
File Format: SchLib


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