MO-229

SON80P400X400X100-9N_JEDEC_MO-229_NXP_HVSON8-SOT909-1-thumb

SON80P400X400X100-9N JEDEC_MO-229 NXP HVSON8/SOT909-1

  Type: Thermally Enhanced Plastic Thin Fine Pitch Small Outline No Lead Package (SON); Package Designator H(V,W,U)F-PSON; Manufacturer: NXP; Package Code: SOT909-1; Pakage title: HVSON8, plastic thermal enhanced very thin small outline package, no leads, 8 terminals; body 4 x 4 x 0.85 mm; Outline version: SOT909-1; Link: http://www.classic.nxp.com/acrobat_download2/packages/SOT909-1.pdf mo-229f.pdf ipc-naming-convention-son.pdf son80p400x400x100-9n_nxp_sot909-1.pdf

SON65P200X200X55-7N_JEDEC_MO-229_VARIATION_WCCC_FAIRCHILD_UMLP06Crev1-thumb

SON65P200X200X55-7N JEDEC MO-229 VARIATION WCCC FAIRCHILD-UMLP06Crev1

  Type: Thermally Enhanced Plastic Thin Fine Pitch Small Outline No Lead Package (SON); Package Designator H(V,W,U)F-PSON; Manufacturer: Fairchild Semiconductor; Package Code: UMLP06C; Pakage title: 6-LD UMLP, DUAL, JEDEC MO-229 2MM SQUARE; Drawing number: MKT-UMLP06C REV 1; Link: http://www.fairchildsemi.com/dwg/UM/UMLP06C.pdf

SON50P400X400X80-13N_JEDEC_MO-229WGGD_Linear-DF-thumb

SON50P400X400X80-13N JEDEC MO-229WGGD Linear-DF

  Type: Thermally Enhanced Plastic Thin Fine Pitch Small Outline No Lead Package (SON); Package Designator H(V,W,U)F-PSON; Manufacturer: Linear Technology; Package Code: DF; Pakage title: 12-Lead Plastic DFN (4mm × 4mm), Document controle number: 05-08-1733 Rev O; Link: http://cds.linear.com/docs/Packaging/DFN_12_05-08-1733.pdf

SON50P300X400X80-15N_JEDEC_MO-229WGED-3_Linear-DE-thumb

SON50P300X400X80-15N JEDEC MO-229WGED-3 Linear-DE

  Type: Thermally Enhanced Plastic Thin Fine Pitch Small Outline No Lead Package (SON); Package Designator H(V,W,U)F-PSON; Manufacturer: Linear Technology; Package Code: DE; Pakage title: 14-Lead Plastic DFN (4mm × 3mm), Document controle number: 05-08-1708 Rev B; Link: http://cds.linear.com/docs/Packaging/DFN_14_05-08-1708.pdf

SON50P300X400X80-13N_JEDEC_MO-229WGED-4_Linear-DE-UE-thumb

SON50P300X400X80-13N JEDEC MO-229WGED-3 Linear-DE/UE

  Type: Thermally Enhanced Plastic Thin Fine Pitch Small Outline No Lead Package (SON); Package Designator H(V,W,U)F-PSON; Manufacturer: Linear Technology; Package Code: DE/UE; Pakage title: 12-Lead Plastic DFN (4mm × 3mm), Document controle number: 05-08-1695 Rev D; Link: http://cds.linear.com/docs/Packaging/DFN_12_05-08-1695.pdf

SON50P300X300X80-9N_JEDEC_MO-229WEED-1_Linear-DD-thumb

SON50P300X300X80-9N JEDEC MO-229WEED-1 Linear-DD

  Type: Thermally Enhanced Plastic Thin Fine Pitch Small Outline No Lead Package (SON); Package Designator H(V,W,U)F-PSON; Manufacturer: Linear Technology; Package Code: DD; Pakage title: 8-Lead Plastic DFN (3mm × 3mm), Document controle number: 05-08-1698 Rev C; Link: http://cds.linear.com/docs/Packaging/DFN_8_05-08-1698.pdf

SON50P300X300X80-11N_JEDEC_MO-229WEED-2_Linear-DD-thumb

SON50P300X300X80-11N JEDEC MO-229WEED-2 Linear-DD

  Type: Thermally Enhanced Plastic Thin Fine Pitch Small Outline No Lead Package (SON); Package Designator H(V,W,U)F-PSON; Manufacturer: Linear Technology; Package Code: DD; Pakage title: 10-Lead Plastic DFN (3mm × 3mm), Document controle number: 05-08-1699 Rev C; Link: http://cds.linear.com/docs/Packaging/DFN_10_05-08-1699.pdf

SON50P300X300X100-9N_JEDEC_MO-229_NXP_HVSON8-SOT908-1-thumb

SON50P300X300X100-9N JEDEC_MO-229 NXP HVSON8/SOT908-1

  Type: Thermally Enhanced Plastic Thin Fine Pitch Small Outline No Lead Package (SON); Package Designator H(V,W,U)F-PSON; Manufacturer: NXP; Package Code: SOT908-1; Pakage title: HVSON8, plastic thermal enhanced very thin small outline package, no leads, 8 terminals; body 3 x 3 x 0.85 mm; Outline version: SOT908-1; Link: http://www.classic.nxp.com/acrobat_download2/packages/SOT908-1.pdf

SON50P300X300X100-11N_JEDEC_MO-229_NXP_HVSON10-SOT650-1-thumb

SON50P300X300X100-11N JEDEC_MO-229 NXP HVSON10/SOT650-1

  Type: Thermally Enhanced Plastic Thin Fine Pitch Small Outline No Lead Package (SON); Package Designator H(V,W,U)F-PSON; Manufacturer: NXP; Package Code: SOT650-1; Pakage title: HVSON10, plastic thermal enhanced very thin small outline package, no leads, 10 terminals; body 3 x 3 x 0.85 mm; Outline version: SOT650-1; Link: http://www.classic.nxp.com/acrobat_download2/packages/SOT650-1.pdf

SON50P300X200X80-7N_JEDEC_MO-229WCED-1_Linear-DCB-thumb

SON50P300X200X80-7N JEDEC MO-229WCED-1 Linear-DCB

  Type: Thermally Enhanced Plastic Thin Fine Pitch Small Outline No Lead Package (SON); Package Designator H(V,W,U)F-PSON; Manufacturer: Linear Technology; Package Code: DCB; Pakage title: 6-Lead Plastic DFN (2mm × 3mm), Document controle number: 05-08-1715 Rev A; Link: http://cds.linear.com/docs/Packaging/(DCB6)%20DFN%2005-08-1715%20Rev%20A.pdf