Abbreviations in Electrical & Electronics Engineering

16QAM (16-state quadrature amplitude modulation)
64QAM (64-state quadrature amplitude modulation)
8DPSK (8-state differential phase shift keying)
A (Ampere, Amp)
A/D (Analog to Digital)
AC (Alternating current)
AC/DC (Alternating current or direct current)
ADC (Analog to digital converter)
AES Advanced Encryption Standard
AFC (Automatic Flow Controller)
AFC (Automatic Frequency Control)
AFT (Automatic fine tuning)
AGC (Automatic gain control)
AGPS (Assisted (or Aided) GPS)
AI (Analog Input)
AI (Artificial Intelligence)
AIAG (Automotive Industry Action Group)
AMOLED (Active-Matrix Organic Light-Emitting Diode)
ANSI (the U.S. American National Standards Institute)
AO (Analog Output)
AoA (Angle of arrival)
AOI (Automatic Optical Inspection)
AP (Access Point)
APFC (Active Power Factor Correction)
API (Application Programming Interface)
ARM (Advanced Reduced instruction set computing Machine)
ASIC (An Application-Specific Integrated Circuit)
ASP (Application Service Provider)
AT ( AT Attachment)
ATAPI (AT Attachment Packet Interface)
AV (Audio/video)
AVDD (Analog Power)
BER (Bit error rate)
BGA (Ball Grid Array)
BiCMOS (Bidirectional CMOS)
BLE (Bluetooth Low Energy)
BOM (Bill Of Materials)
bps (bit per second)
BSM (Body Control Module)
CA (Conditional Access)
CA (Criticality Analysis)
CAD (Computer-Aided Design)
CAM (Conditional Access Module)
CAN (Controller Area Network)
CAPAD (Capacitors Non Polarized Axial Diameter Horizontal Mounting)
CAPADV (Capacitors Non Polarized Axial Diameter Vertical Mounting)
CAPAE (Capacitor Aluminum Electrolytic)
CAPAR (Capacitors Non Polarized Axial Rectangular)
CAPARV (Capacitors Non Polarized Axial Rect. Vertical Mounting)
CAPC (Capacitor Chip Non-polarized)
CAPCAF (Capacitor Chip Array Flat)
CAPCAV (Capacitor Chip Array Concave)
CAPCP (Capacitor Chip Polarized)
CAPCWR (Capacitor Chip Wire Rectangle)
CAPM (Capacitor Molded Non-polarized)
CAPMP (Capacitor Molded Polarized)
CAPPA (Capacitors Polarized Axial Diameter Horizontal Mounting)
CAPPRD (Capacitors Polarized Radial Diameter)
CAPRB (Capacitors Non Polarized Radial Disk Button Vertical)
CAPRD (Capacitors Non Polarized Radial Diameter)
CAPRR Capacitors Non Polarized Radial Rectangular Vertical
CAS (Conditional Access System)
CBC (Cipher Block Chaining mode)
CC (Cable Card)
CCIPCA (Candid Covariance Free Incremental Principal Component Analysis)
CFP (Ceramic Flat Package)
CI (Common Interface protocol)
CiA (CAN in Automation, see also CAN)
CIS (Component Information System)
CLK (Clock)
CLKOUT (Clock Output)
CM (Multimedia Codec Manager)
CMOS (Complementary Metal – Oxide Semiconductor)
CMRR (Common Mode Rejection Ratio)
COR (Cranking Operative Range)
CQFP (Ceramic Quad Flat Packages)
CS (Chip Select)
CSA (Common Scrambling Algorithm)
CSL (Coordinated Sample Listing)
CTE (Coefficient of Thermal Expansion)
CVBS (Color Video Blanking and Sync)
D (Detection)
D/A (Digital to Analog)
DAC (Digital to Analog Converter)
DBS (Dual-band simultaneous)
DC (Diagnostic Covearage)
DDR (Double Data RAM)
DDR (Double Data Rate)
DES (Data Encryption Standard)
DFHP (Device-Free Human Presence)
DFMEA (Design FMEA see FMEA)
DFN (Dual Flat No-lead)
DI (Digital Input)
DIA (Divelopment Interface Agreement)
DIOAD (Diodes Axial Diameter Horizontal)
DIOADV (Diodes Axial Diameter Vertical)
DIOC (Diode Chip)
DIOM (Diode Molded)
DIOMELF (Diode metal electrode leadless face melf)
DIOSC (Diode Side Concave)
DIP (Dual-in-Line Package)
DIPS (Dual-In-Line Sockets)
DK (Development Kit)
DMA (Direct Memory Access)
DNC (Do Not Connect)
DO (Digital Output)
DRAM (Dynamic Random Access Memory)
DRBFM (Design Review Based on Failure Mode)
DRM (Digital Rights Management)
DSL (Digital Subscriber Line)
DSP (Digital signal processor)
DTCP-IP (Digital Transmission Content Protection over Internet Protocol)
DTE (Data Terminal Equipment)
DTV (Digital TeleVision)
DUT (Device Under Test)
DVB (Digital Video Broadcasting)
DVB-C (Digital Video Broadcasting – Cable)
DVB-S (Digital Video Broadcasting – Satellite)
DVB-S2 (Digital Video Broadcasting – Satellite Second Generation)
DVB-T (Digital Video Broadcasting – Terrestrial)
DVB-T2 (Digital Video Broadcasting – Second Generation Terrestrial)
DVDD (Digital Power)
E/E System (Electrical and/or Electronic System)
E2LP (Embedded Engineering Learning Platform)
ECAD (Electronic Computer-Aided Design)
ECB (Electronic Codebook mode)
ECDM (Electronic Component Data Management)
ECM (Entitlement Control Management)
ECO (Engineering change orders)
EDA (Electronic Design Automation)
EDC (Error Detection-correction Codes)
EDR (Enhanced data rate)
EGNOS (European Geostationary Navigation Overlay Service)
EIA (Electronic Industries Alliance)
Electrolytic Ni /Au (Electrolytic Nickel / Gold)
EMI (Electromagnetic interference)
EMM (Entitlement Management Message)
eMMC (Embedded Multimedia Card)
ENIG (Electroless Nickel-Immersion Gold)
ENIP (Electroless Nickel-Immersion Palladium)
ESCL (Electronic Steering Column Lock)
ESD (Electro-Static Discharge)
ESL (Equivalent Series Inductance)
ESR (Equivalent Series Resistance)
ESR (Equivalent Series Resistance)
ETH (Ethernet)
ETSI (European Telecommunications Standards Institute)
EVM (Error Vector Magnitude)
EVM (EValuation Module)
FIFO (First In First Out)
FIT (Failure In Time)
FMC (FPGA Mezzanine Card)
FMEA (Failure Mode and Effects Analysis)
FMEA (Failure Modes and Effects Analysis)
FMECA (Failure Mode, Effects and Criticality Analysis)
FMEDA (Failure Modes, Effects and Diagnostic Analysis)
FMMEA (Failure Modes, Mechanisms and Effect Analysis)
FPGA (Field-Programmable Gate Array)
FSC (Functional Safety Concept)
FTA (Fault Tree Analysis)
FTTI (Fault Tolerant Time Interval)
FUSM (Fuse Molded)
GDOP (Geometric Dilution of Precision)
GLONASS (Global Navigation Satellite System)
GND (Ground)
GNSS (Global Navigation Satellite System)
GPIO (General Purpose Input Output)
GPS (Global Positioning System)
GUI (Graphic User Interface)
H&R (Hazard Analysis and Risk Assessment)
HAL (Hardware Abstraction Layer)
HASL (Hot Air Solder Level)
HD (High Definition)
HDMI (High-Definition Multimedia Interface)
HDR (Header)
HDRRA (Header Right Angle)
HDRV (Header Vertical)
HDTV (High Definition TV)
HPC (High Pin Count)
HS (High Speed)
HSDPA (High Speed Downlink Packet Access)
HSIC (High Speed Inter Chip)
HSUPA (High Speed Uplink Packet Access)
I/O (Input Output)
I2C (Inter-Integrated Circuit)
I2S (Inter-IC Sound)
IC (Integrated Cicuit)
IDE (Integrated Drive Electronics)
IEEE (Institute of Electrical and Electronics Engineers)
Imm Ag (Immersion Silver)
Imm Sn (Immersion Tin)
INDAD (Inductor Axial Diameter Horizontal Mounting)
INDADV (Inductor Axial Diameter Vertical Mounting)
INDC (Inductor Chip)
INDCAF (Inductor Chip Array Flat)
INDCAV (Inductor Chip Array Concave)
INDM (Inductor Molded)
INDP (Inductor Precision Wire Wound)
INDRD (Inductors Radial Diameter)
IoE (Internet of Everything)
IoT (Internet of Things)
IP (Intellectual Property)
IP (Internet Protocol)
IPC (Interconnecting and packaging electronic Circuit)
IR (Infra Red)
ISO (International Standardization Organization)
ISP (Internet service provider)
JESD (JEDEC standards)
JTAG (Joint Test Action Group)
JUMP (Jumper)
kbps (kilobits per second)
KL (German abbriviation for Klemme, Eng. Contact in the vehicle)
KL15 (is position #2 (on) of ignition switch in the vehicle)
KL30 (is battery positive contact, connected all the time in the vehicle)
KL31 (is battery negative contact, connected all the time in the vehicle)
KL50 (is position #3 (start) of ignition switch in the vehicle)
KLR (means position #1 (accessory) of ignition switch in the vehicle)
LCC (Quad Leadless Ceramic Chip Carrier)
LCCS (Quad Leadless Ceramic Chip Carrier)
LCD (Liquid-crystal display)
LCM (Lighting Connectivity Module)
LED (Light-emiting diode)
LEDM (LED Molded)
LEDSC (LED Side Concave)
LFM (Latent Fault Metric)
LGA (Land Grid Array)
LIN (Local Interconnect Network)
LLC (Leadless Chip Carrier)
LNA (Low Noise Amplifier)
LPC (Low Pin Count)
LPCM (Linear pulse-code modulation)
LPRF (Low Power RF)
LTE (Long-Term Evolution)
LTE (Long-Term Evolution)
LTI (Lead Tip Inspection)
M2M (Machine to Machine)
MCAD (Mechanical Computer-Aided Design)
MDIO (Management Data Input Output)
MIB (Management Information Base)
MICTOS (MICronas TV Operating System)
MII (Media Indenpendet Interface)
MISO (Master Input Slave Output)
MMC (MultiMediaCard)
MMP (MultiMedia Player)
MMU (Memory Management Unit)
MOSI (Master Output Slave Input)
MPEG (Motion Picture Experts Group)
MRDY (Master Ready)
MSD (Mass Storage Device)
MSD (Moisture sensitive device)
MSL (Moisture Sensitivity Level)
MTSAT (Multifunctional Transport Satellites)
N/A (Not applicable)
NA (Network Analyzer)
Nagra PRM (Nagra Media Persistent Rights Management)
NC (No Connection)
NIM (Network Interface Module)
NM (Not Mounted)
NMEA (National Marine Electronics Association)
NPTH (Non Plated Through Hole)
NTSC (National Television System Committee)
OD (Open Drain)
OD (Outside Diameter)
ODVA (Open DeviceNet Vendors Association)
OEM (Original Equipment Manufacturer)
OMAC (One-key Message Authentication Code)
OS (Operating System)
OSC (Oscillator)
OSCCC (Oscillator Corner Concave)
OSCJ (Oscillator J-Lead)
OSCL (Oscillator L-Bend Lead)
OSCSC (Oscillator Side Concave)
OSI (Open Systems Interconnection)
OSP (Organic Solderability Preservative)
OTG (On-The-Go)
P (Probability)
PA (Power amplifier)
PAD (Process Application Definition)
PADS (Personal Automated Design System)
PAL (Phase Alternating Line)
PAL (Programmable Array Logic)
PATA (Parallel ATA)
PBL (Primary Boot Load)
PCB (Printed Circuit Board)
PCMCIA (Personal Computer Memory Card International Association)
PDET (Power detector)
PES (Project Engineer for Safety)
PFH (Probability of dangerous Failure per Hour)
PFMEA (Process FMEA see FMEA)
PGA (Pin Grid Array)
PID (Packet Identifier)
PIR (Passive Infrared Sensors)
PLCC (Plastic Leaded Chip Carrier)
PLCCS (Plastic Leaded Chip Carrier Socket Square)
PM (Power management)
PMHF (Probabilistic Metric for Random Hardware Failures)
PMIC (Power management integrated circuit)
PQFN (Pull-back Quad Flat No-lead)
PS (Power Supply)
PSE (Project Safety Engineer)
PSON (Pull-back Small Outline No-lead)
PTH (Plated Through Hole)
PVR (Personal video recorder)
PWM (Pulse Width Modulation)
PWR (Power)
QFN (Quad Flat No-lead)
QFP (Quad Flat Package)
QZSS (Quasi-Zenith Satellite System)
RAM (Random-Access Memory)
RAM (Read-Only Memory)
RCA (Radio Corporation of America)
RCF (Relative Centrifugal Force)
RDBS (Radio Broadcast Data System)
RDS (Radio Data System)
RESAD (Resistor Axial Diameter Horizontal Mounting)
RESADV (Resistor Axial Diameter Vertical Mounting )
RESAR (Resistor Axial Rectangular Horizontal Mounting)
RESC (Resistor Chip)
RESCAF (Resistor Chip Array Flat)
RESCAXE (Resistor Chip Array Convex E-Version (Even Pin Size))
RESCAXS (Resistor Chip Array Convex S-Version (Side Pins Diff))
RESM (Resistor Molded)
RESMELF (Resistor MELF)
RFI (Radio Frequency Interference)
RGMII (Reduced Gigabit Ethernet Media Independent Interface)
RH (Relative humidity)
RHFT (Random Hardware Failure Target values)
RISC (Reduced Instruction Set Computer)
RoHS (Restriction of Hazardous Substances)
RPM (Revolutions Per Minute)
RPM (Rotations Per Minute)
RPN (Risk Priority Number)
RSSI (Received Signal Strength Indicator)
RTC (Real Time Clock)
RTF (Rich Text Format)
RTOS (Real-Time Operating System)
S (Severity)
S2E (Serial-to-Ethernet)
SAE (Society for Automotive Engineers)
SATA (Serial ATA)
SAW (Surface Acoustic Wave filter)
SBAS (Satellite Based Augmentation System)
SBC (System Basis Chip)
SC (Smart Card)
SCL (System Control Layer)
SCTE Society of Cable Telecommunications Engineers
SD (Secure Digital)
SD (Standard definition)
SDRAM (Synchronous Dynamic Random-Access Memory)
SDT (Schematic Design Tools)
SDTV (Standard Definition Television)
SECAM (Séquentiel Couleur Avec Mémoire (French Color TV Standard))
SenML (Sensor Markup Language)
SFPS (Early identification of single failure points)
SFS (Streaming File System)
SG (Safety Goal)
SIM (Subscriber Identification Module)
SIP (Single-In-Line Package)
SMSC (Standard Microsystems Corporation)
SMT (Surface mount technology)
SnPb (Tin-Lead (for solder))
SoC (System on Chip)
SOD (Small Outline Diode)
SODFL (Small Outline Diode Flat Lead)
SOIC (Small Outline Integrated Circuit)
SOJ (Small Outline IC J-Leaded)
SON (Small Outline No-lead)
SOP (Small Outline Package)
SOTFL (Small Outline Transistor Flat Lead)
SPFM (Single Point Fault Metric)
SPI (Serial Peripheral Interface)
SQFP (Shrink Quad Flat Packages)
SRDY (Slave Ready)
SRO (Solder resistant opening)
SSOP (Shrink Small Outline Package)
SSR (Solid State Relay)
SSS (Selective Solder Strip)
SSTL (Stub Series Terminated Logic)
STB (Set Top Box)
TBD (To Be Determined)
TCP (Transmission Control Protocol)
TCP/IP (Transmission Control Protocol/Internet Protocol)
TCXO (Temperature-Compensated Crystal Oscillator)
TDES (Triple Data Encryption Standard)
TI (Texas Instruments)
TP (Test Point)
TQFP (Thin Quad Flat Package)
TRNG (True Random Number Generator)
TS (Transport Stream)
TSC (Technical Safety Concept)
TSOP (Thin Small Outline Package)
TSQFP (Thin Shrink Quad Flat Packages)
TSSOP (Thin Shrink Small Outline Package)
TTFF (Time to First Fix)
TTSC (Telit Technical Support Centre)
UART (Universal Asynchronous Receiver/Transmitter)
ULPI (Utmi+ Low Pin Interface)
UMTS (Universal Mobile Telecommunication System)
UPnP (Universal Plug and Play)
USB (Universal Serial Bus)
V2X (Vehicle to Everything)
VBATT (Battery Power Supply)
VGA (Video Graphics Array)
VNA (Vector Network Analyzer)
VSWR (Voltage Standing Wave Ratio)
WAAS (Wide Area Augmentation System)
WAN (Wide Area Networks)
WCDMA (Wideband Code Division Multiple Access)
Wi-Fi (Wireless Internet Free Internet)
WLAN (Wireless Local Area Network)
WLPSP Wafer Level Pico Scale Package
WPS (Wi-Fi Protected Setup)
WSI (WLAN to Serial interface)
xSP (Hosted Service Provider)
XTAL (Crystal)
Z (Impedance)
ZIF (Zero Insertion Force)

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