Download 3D STEP Model - BGA6C40P2X3 95X116X56 Analog Devices CB-6-15 6-Ball WLCSP

Mount Type: Surface Mount
Electric Type: Ball Grid Arrays BGA
Manufacturer: Analog Devices
Membership Type: Free

BGA6C40P2X3-95X116X56-Analog-Devices-CB-6-15-6-Ball-WLCSP

Package Description:

Pin Qty = 40; Pitch = 0.4mm; Ball Columns = 2; Ball Rows = 3; Body Length = 1.16mm; Body Width = 0.95mm; Component Height Max (Body Height) = 0.56mm; Ball Diameter = 0.26mm; 6-Ball Wafer Level Chip Scale Package [WLCSP] 1.00 mm × 1.20 mm Body (CB-6-15) Dimensions shown in millimeters.

IPC-7351 Naming Convention for Ball Grid Array’s (BGA)

BGA – Ball Grid Array’s
BGA + Pin Qty + C or N + Pitch P + Ball Columns X Ball Rows _Body Length X Body Width X Height
BGA – Ball Grid Array’s w/Dual Pitch
BGA + Pin Qty + C or N + Colum Pitch X Row Pitch P + Ball Columns X Ball Rows _Body Length X Body Width X Height
BGAS – Ball Grid Array’s w/Staggered Pins
BGAS + Pin Qty + C or N + Pitch P + Ball Columns X Ball Rows _Body Length X Body Width X Height

Example:

BGA63C80P10X12_900X1100X100_VFBGA_63
BGA = Ball Grid Array’s, Surface mount package
63 – Pin Qty = 63
80P – Pitch = 0.8mm
10 – Ball Columns = 10
12 – Ball Rows = 12
900 – Body Length = 9.00mm
1100 – Body Width = 11.00mm
100 – Component Height (Body Height) = 1.00mm
VFBGA_63 – Manufacturer Code/Manufacturer Series (Added by PCB-3D.com)

Datasheet or Drawing

File Name: BGA6C40P2X3_95X116X56_Analog_Devices_CB-6-15_6-Ball_WLCSP.pdf
File Format: pdf

3D CAD Model - STEP

File Name: BGA6C40P2X3_95X116X56_Analog_Devices_CB-6-15_6-Ball_WLCSP
File Format: STEP

Altium Designer - Footprint

File Name:
File Type: PCB Library (Footprint)
File Format: PcbLib

Altium Designer - Schematic Symbol

File Name:
File Type: Schematic Library (Schematic Symbol)
File Format: SchLib

Manufacturer Part Numbers:

ADP7112ACBZ-1.2-R7; ADP7112ACBZ-1.8-R7; ADP7112ACBZ-2.5-R7; ADP7112ACBZ-3.3-R7; ADP7112ACBZ-5.0-R7;