Download 3D STEP Model - QFN50P600X600X85-40-MO-220-NXP-SOT618-1-HVQFN40-wm

Mount Type: Surface Mount
Electric Type: QFN with Thermal Pad
Manufacturer: NXP Semiconductors
Membership Type: Free


Package Description:

Pitch = 0.50mm; Body Width = 6.00mm; Body Length = 6.00mm; Max Height/Thickness = 0.85mm; Pin Quantity = 28;
SOT618-1 Plastic thermal enhanced very thin quad flat package; no leads; 40 terminals; body 6 x 6 x 0.85 mm

Package summary
Terminal position code Q (quad)
Package type descriptive code HVQFN40
Package type industry code HVQFN40
Package style descriptive code HVQFN (thermal enhanced very thin quad flatpack; no leads)
Package body material type P (plastic)
JEDEC package outline code MO-220
Mounting method type S (surface mount)
Issue date 22-10-2002

IPC-7351B Naming Convention for Quad Flat No-Lead with Thermal Pad QFN

QFN + Pitch P + Body Width X Body Length X Height Pin Quantity



QFN – Quad Flat No-Lead
50 – Pitch = 0.50mm
500 – Body Width = 5.00mm
500 – Body Length = 5.00mm
100 – Height = 1.00mm
28 – Pin Quantity
JEDEC_MO-220VHHD – Standard Package Name (Added by
Silab – Manufacturer Name (Added by
QFN-28 – Manufacturer Code/Package Name (Added by

Datasheet or Drawing

File Name: QFN50P600X600X85-40-MO-220-NXP-SOT618-1-HVQFN40.pdf
File Format: pdf

3D CAD Model - STEP

File Format: STEP

Altium Designer - Footprint

File Name:
File Type: PCB Library (Footprint)
File Format: PcbLib

Altium Designer - Schematic Symbol

File Name:
File Type: Schematic Library (Schematic Symbol)
File Format: SchLib

Manufacturer Part Numbers: