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Download 3D STEP Model - SOP50P490X110-16-Linear-MSE-Package-16-Lead-Plastic-MSOP-Exposed-Die-Pad-dwg-05-08-1667-Rev-F-wm

Package Description:

MSE Package; 16-Lead Plastic MSOP, Exposed Die Pad (Reference LTC DWG # 05-08-1667 Rev F)

NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006″) PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS. INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006″) PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004″) MAX
6. EXPOSED PAD DIMENSION DOES INCLUDE MOLD FLASH. MOLD FLASH ON E-PAD SHALL NOT EXCEED 0.254mm (.010″) PER SIDE.

IPC-7351B Naming Convention for

Small Outline Integrated Circuit (SOIC) and

Small Outline Package (SOP)

SOP + Pitch + P + Lead Span Nominal X Height – Pin Qty
SOIC + Pitch + P + Lead Span Nominal X Height – Pin Qty

Example:

SOIC127P600x175-8_JEDEC_MS-012AA

SOP/SOIC = Surface Mount Plastic Small Outline Package/Integrated Circuit
127P – Pitch = 1.27mm(0.05inch)
600 – Lead Span Nominal = 6.00mm
175 – Component Height (Body Height) = 1.75mm
8 – Pins Qty = 8
JEDEC_MS-012AA – Standard Package Name (Added by PCB-3D.com)

Datasheet or Drawing

File Name: SOP50P490X110-16-Linear-MSE-Package-16-Lead-Plastic-MSOP-Exposed-Die-Pad-dwg-05-08-1667-Rev-F.pdf
File Format: pdf

3D CAD Model - STEP

File Format: STEP

Altium Designer - Footprint

File Name:
File Type: PCB Library (Footprint)
File Format: PcbLib

Altium Designer - Schematic Symbol

File Name:
File Type: Schematic Library (Schematic Symbol)
File Format: SchLib

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