Download 3D STEP Model - BGA484C80P22X22 1900X1900X190 JEDEC MO-308-AAG-2 Altera 484-Pin UBGA 04R-00436-2-0

Package Description:

Description: 04R-00436-2.0; 484-Pin Ultra FineLine Ball-Grid Array (UBGA) – Wire Bond – A:1.90; Ordering Code Reference U; Package Acronym UBGA; Substrate Material BT; Solder ball composition Regular: 63Sn:37Pb (Typ.); Pb-free: Sn:3Ag:0.5Cu (Typ.); JEDEC Outline Reference MO-308 Variation: AAG-2; Lead Coplanarity 0.005 inch (0.12 mm); Weight 1.4 g (Typ.); Moisture Sensitivity Level Printed on moisture barrier bag

IPC-7351 Naming Convention for Ball Grid Array’s (BGA)

BGA – Ball Grid Array’s
BGA + Pin Qty + C or N + Pitch P + Ball Columns X Ball Rows _Body Length X Body Width X Height
BGA – Ball Grid Array’s w/Dual Pitch
BGA + Pin Qty + C or N + Colum Pitch X Row Pitch P + Ball Columns X Ball Rows _Body Length X Body Width X Height
BGAS – Ball Grid Array’s w/Staggered Pins
BGAS + Pin Qty + C or N + Pitch P + Ball Columns X Ball Rows _Body Length X Body Width X Height

Example:

BGA63C80P10X12_900X1100X100_VFBGA_63
BGA = Ball Grid Array’s, Surface mount package
63 – Pin Qty = 63
80P – Pitch = 0.8mm
10 – Ball Columns = 10
12 – Ball Rows = 12
900 – Body Length = 9.00mm
1100 – Body Width = 11.00mm
100 – Component Height (Body Height) = 1.00mm
VFBGA_63 – Manufacturer Code/Manufacturer Series (Added by PCB-3D.com)

Datasheet or Drawing

File Name: BGA484C80P22X22_1900X1900X190_JEDEC_MO-308-AAG-2_Altera_484-Pin_UBGA_04R-00436-2-0.pdf
File Format: pdf

3D CAD Model - STEP

File Format: STEP

Altium Designer - Footprint

File Name:
File Type: PCB Library (Footprint)
File Format: PcbLib

Altium Designer - Schematic Symbol

File Name:
File Type: Schematic Library (Schematic Symbol)
File Format: SchLib