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Download 3D STEP Model - BGA64C50P8X8 447X439X63 ST Microelectronics WLCSP64

Package Description:

Pin Qty = 64; Pitch = 0.5mm; Ball Columns = 8; Ball Rows = 8; Body Length = 4.395mm; Body Width = 4.466mm; Component Height Max (Body Height) = 0.635mm; Ball Diameter = 0.32mm;
WLCSP64 – 64-ball, 4.4757 x 4.4049 mm, 0.5 mm pitch wafer level chip scale package.

WLCSP64 recommended PCB design rules (0.5 mm pitch)
Dpad 250 µm
Dsm 300 µm
Stencil Opening 320 µm
Stencil Thickness Between 100 µm to 125 µm
Pad trace width 100 µm
Ball Diameter 320 µm

IPC-7351 Naming Convention for Ball Grid Array’s (BGA)

BGA – Ball Grid Array’s
BGA + Pin Qty + C or N + Pitch P + Ball Columns X Ball Rows _Body Length X Body Width X Height
BGA – Ball Grid Array’s w/Dual Pitch
BGA + Pin Qty + C or N + Colum Pitch X Row Pitch P + Ball Columns X Ball Rows _Body Length X Body Width X Height
BGAS – Ball Grid Array’s w/Staggered Pins
BGAS + Pin Qty + C or N + Pitch P + Ball Columns X Ball Rows _Body Length X Body Width X Height

Example:

BGA63C80P10X12_900X1100X100_VFBGA_63
BGA = Ball Grid Array’s, Surface mount package
63 – Pin Qty = 63
80P – Pitch = 0.8mm
10 – Ball Columns = 10
12 – Ball Rows = 12
900 – Body Length = 9.00mm
1100 – Body Width = 11.00mm
100 – Component Height (Body Height) = 1.00mm
VFBGA_63 – Manufacturer Code/Manufacturer Series (Added by PCB-3D.com)

Datasheet or Drawing

File Name: BGA64C50P8X8_447X439X63_ST_Microelectronics_WLCSP64_4-466x4-395_0-5mmP.pdf
File Format: pdf

3D CAD Model - STEP

File Format: STEP

Altium Designer - Footprint

File Name:
File Type: PCB Library (Footprint)
File Format: PcbLib

Altium Designer - Schematic Symbol

File Name:
File Type: Schematic Library (Schematic Symbol)
File Format: SchLib

Manufacturer Part Numbers: