Download 3D STEP Model - BGA760C40P45X40 1400X1200X104 Qualcomm 760 NSP 14X12X1-04mm APQ8039
Package Description:
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IPC-7351 Naming Convention for Ball Grid Array’s (BGA)
BGA – Ball Grid Array’s
BGA + Pin Qty + C or N + Pitch P + Ball Columns X Ball Rows _Body Length X Body Width X Height
BGA – Ball Grid Array’s w/Dual Pitch
BGA + Pin Qty + C or N + Colum Pitch X Row Pitch P + Ball Columns X Ball Rows _Body Length X Body Width X Height
BGAS – Ball Grid Array’s w/Staggered Pins
BGAS + Pin Qty + C or N + Pitch P + Ball Columns X Ball Rows _Body Length X Body Width X Height
Example:
BGA63C80P10X12_900X1100X100_VFBGA_63
BGA = Ball Grid Array’s, Surface mount package
63 – Pin Qty = 63
80P – Pitch = 0.8mm
10 – Ball Columns = 10
12 – Ball Rows = 12
900 – Body Length = 9.00mm
1100 – Body Width = 11.00mm
100 – Component Height (Body Height) = 1.00mm
VFBGA_63 – Manufacturer Code/Manufacturer Series (Added by PCB-3D.com)
Datasheet or Drawing
File Name: BGA760C40P45X40_1400X1200X104_Qualcomm_760_NSP_14X12X1-04mm_APQ8039.pdf File Format: pdf
3D CAD Model - STEP
File Format: STEP
Altium Designer - Footprint
File Name: File Type: PCB Library (Footprint) File Format: PcbLib
Altium Designer - Schematic Symbol
File Name: File Type: Schematic Library (Schematic Symbol) File Format: SchLib