Home » Models » ICs » QFN with Thermal Pad » QFN50P500X400X80-28-MO-220-Linear-UFD-28-QFN-4mmX5mm-05-08-1712-Rev-B-wm

Download 3D STEP Model - QFN50P500X400X80-28-MO-220-Linear-UFD-28-QFN-4mmX5mm-05-08-1712-Rev-B-wm

Package Description:

Pitch = 0.50mm; Body Width = 5.00mm; Body Length = 4.00mm; Max Height/Thickness = 0.80mm; Pin Quantity = 28;
UFD Package; 28-Lead Plastic QFN (4mm × 5mm); (UFD28) QFN 0506 REV B; (Reference LTC DWG no 05-08-1712 Rev B)
Please refer to http://www.linear.com/product/LT4276#packaging for the most recent package drawings.
NOTE:
1. DRAWING PROPOSED TO BE MADE A JEDEC PACKAGE OUTLINE MO-220 VARIATION (WXXX-X).
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE

IPC-7351B Naming Convention for Quad Flat No-Lead with Thermal Pad QFN

QFN + Pitch P + Body Width X Body Length X Height – Pin Quantity

Example:

QFN50P500X500X100-28_JEDEC_MO-220VHHD_Silab_QFN-28

QFN – Quad Flat No-Lead
50 – Pitch = 0.50mm
500 – Body Width = 5.00mm
500 – Body Length = 5.00mm
100 – Height = 1.00mm
28 – Pin Quantity
JEDEC_MO-220VHHD – Standard Package Name (Added by PCB-3D.com)
Silab – Manufacturer Name (Added by PCB-3D.com)
QFN-28 – Manufacturer Code/Package Name (Added by PCB-3D.com)

Datasheet or Drawing

File Name: QFN50P500X400X80-28-MO-220-Linear-UFD-28-QFN-4mmX5mm-05-08-1712-Rev-B.pdf
File Format: pdf

3D CAD Model - STEP

File Format: STEP

Altium Designer - Footprint

File Name:
File Type: PCB Library (Footprint)
File Format: PcbLib

Altium Designer - Schematic Symbol

File Name:
File Type: Schematic Library (Schematic Symbol)
File Format: SchLib

Manufacturer Part Numbers: