Download 3D STEP Model - SON45P300X300X80-13-TI-WSON12-DPD0012A-3mmx3mm-0-8mm-max-height
Package Description:
PACKAGE OUTLINE DPD0012A WSON – 0.8 mm max height PLASTIC SMALL OUTLINE – NO LEAD
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.
IPC-7351B Naming Convention for Small Outline No-Lead with Thermal Pad SON
SON + Pitch + P + Body Width X Body Length X Height – Pin Qty + Thermal Pad
Example:
SON50P200X300X80-11N_JEDEC_MO-229WECD-2_Linear-DDB
SON – Thermally Enhanced Plastic Small Outline No-Lead
50 – Pitch = 0.50mm
200 – Body Width = 2.00mm
300 – Body Length = 3.00mm
80 – Height = 0.80mm
11 Pin Qty = 11 (10 Pins + 1 Thermal Pad)
JEDEC_MO-229WECD-2 – Standard Package Name (Added by PCB-3D.com)
Linear – Manufacturer Name (Added by PCB-3D.com)
DDB – Manufacturer Code, Package Name or Package Code (Added by PCB-3D.com)
Datasheet or Drawing
File Name: SON45P300X300X80-13-TI-WSON12-DPD0012A-3mmx3mm-0-8mm-max-height.pdf File Format: pdf
3D CAD Model - STEP
File Format: STEP
Altium Designer - Footprint
File Name: File Type: PCB Library (Footprint) File Format: PcbLib
Altium Designer - Schematic Symbol
File Name: File Type: Schematic Library (Schematic Symbol) File Format: SchLib
Manufacturer Part Numbers:
TPS65133DPDR