Download 3D STEP Model - SON50P300X400X80-13N JEDEC MO-229WGED-4 Linear-DE-UE
Package Description:
IPC-7351B Naming Convention for Small Outline No-Lead with Thermal Pad SON
SON + Pitch + P + Body Width X Body Length X Height – Pin Qty + Thermal Pad
Example:
SON50P200X300X80-11N_JEDEC_MO-229WECD-2_Linear-DDB
SON – Thermally Enhanced Plastic Small Outline No-Lead
50 – Pitch = 0.50mm
200 – Body Width = 2.00mm
300 – Body Length = 3.00mm
80 – Height = 0.80mm
11 Pin Qty = 11 (10 Pins + 1 Thermal Pad)
JEDEC_MO-229WECD-2 – Standard Package Name (Added by PCB-3D.com)
Linear – Manufacturer Name (Added by PCB-3D.com)
DDB – Manufacturer Code, Package Name or Package Code (Added by PCB-3D.com)
Datasheet or Drawing
File Name: SON50P300X400X80-13N_JEDEC_MO-229WGED-4_Linear-DE-UE.pdf File Format: pdf
3D CAD Model - STEP
File Format: STEP
Altium Designer - Footprint
File Name: File Type: PCB Library (Footprint) File Format: PcbLib
Altium Designer - Schematic Symbol
File Name: File Type: Schematic Library (Schematic Symbol) File Format: SchLib