Home » Models » ICs » SON with Thermal Pad » SON65P300X300X100-9-TI-8-pin-VSON-DRB8-3mmx3mm-1mm-max-height-DRB0008J-wm

Download 3D STEP Model - SON65P300X300X100-9-TI-8-pin-VSON-DRB8-3mmx3mm-1mm-max-height-DRB0008J-wm

Package Description:

PACKAGE OUTLINE DRB0008J
4225036/A 06/2019
www.ti.com
VSON – 1 mm max height
PLASTIC QUAD FLAT PACK- NO LEAD

NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for optimal thermal and mechanical performance.

IPC-7351B Naming Convention for Small Outline No-Lead with Thermal Pad SON

SON + Pitch + P + Body Width X Body Length X Height – Pin Qty + Thermal Pad

Example:

SON50P200X300X80-11N_JEDEC_MO-229WECD-2_Linear-DDB

SON – Thermally Enhanced Plastic Small Outline No-Lead
50 – Pitch = 0.50mm
200 – Body Width = 2.00mm
300 – Body Length = 3.00mm
80 – Height = 0.80mm
11 Pin Qty = 11 (10 Pins + 1 Thermal Pad)
JEDEC_MO-229WECD-2 – Standard Package Name (Added by PCB-3D.com)
Linear – Manufacturer Name (Added by PCB-3D.com)
DDB – Manufacturer Code, Package Name or Package Code (Added by PCB-3D.com)

Datasheet or Drawing

File Name: SON65P300X300X100-9-TI-8-pin-VSON-DRB8-3mmx3mm-1mm-max-height-DRB0008J.pdf
File Format: pdf

3D CAD Model - STEP

File Format: STEP

Altium Designer - Footprint

File Name:
File Type: PCB Library (Footprint)
File Format: PcbLib

Altium Designer - Schematic Symbol

File Name:
File Type: Schematic Library (Schematic Symbol)
File Format: SchLib

Manufacturer Part Numbers: