Download 3D STEP Model - SOP65P810X120-28N JEDEC MO-153DB
Package Description:
IPC-7351B Naming Convention for
Small Outline Integrated Circuit (SOIC) and
Small Outline Package (SOP)
SOP + Pitch + P + Lead Span Nominal X Height – Pin Qty
SOIC + Pitch + P + Lead Span Nominal X Height – Pin Qty
Example:
SOIC127P600x175-8_JEDEC_MS-012AA
SOP/SOIC = Surface Mount Plastic Small Outline Package/Integrated Circuit
127P – Pitch = 1.27mm(0.05inch)
600 – Lead Span Nominal = 6.00mm
175 – Component Height (Body Height) = 1.75mm
8 – Pins Qty = 8
JEDEC_MS-012AA – Standard Package Name (Added by PCB-3D.com)
Datasheet or Drawing
File Name: SOP_JEDEC_MO-153F.pdf File Format: pdf
3D CAD Model - STEP
File Format: STEP
Altium Designer - Footprint
File Name: File Type: PCB Library (Footprint) File Format: PcbLib
Altium Designer - Schematic Symbol
File Name: File Type: Schematic Library (Schematic Symbol) File Format: SchLib