Download 3D STEP Model - TO127P600X120-4 JEDEC MO-235 NXP SOT669 LFPAK56 Power-SO8 4 Leads
Package Description:
IPC-7351B Naming Convention for Transistor Outline TO (DPAK, D2PAK)
TO + Pitch + P + Lead Span Nominal X Height – Pin Qty
Example:
TO170P1435X465-5N_JEDEC_MO-169AB_D2PAK
TO – Surface Mount Plastic Transistor Outline Header Family
170P – Pitch = 1.70mm
1435 – Lead Span Nominal = 14.35mm
465 – Component Height (Body Height) = 4.65mm
5 – Pins Qty = 5
JEDEC_MO-169AB_D2PAK – Standard Package Name (Added by PCB-3D.com)
Datasheet or Drawing
File Name: TO127P600X120-4_JEDEC_MO-235_NXP_SOT669_LFPAK56_Power-SO8_4_Leads.pdf File Format: pdf
3D CAD Model - STEP
File Format: STEP
Altium Designer - Footprint
File Name: File Type: PCB Library (Footprint) File Format: PcbLib
Altium Designer - Schematic Symbol
File Name: File Type: Schematic Library (Schematic Symbol) File Format: SchLib