Download 3D STEP Model - TO127P600X120-4 JEDEC MO-235 NXP SOT669 LFPAK56 Power-SO8 4 Leads

Mount Type: Surface Mount
Electric Type: TO DPAK D2PAK
Manufacturer: NXP Semiconductors
Membership Type: Membership


Package Description:

IPC-7351B Naming Convention for Transistor Outline TO (DPAK, D2PAK)

TO + Pitch + P + Lead Span Nominal X Height – Pin Qty



TO – Surface Mount Plastic Transistor Outline Header Family
170P – Pitch = 1.70mm
1435 – Lead Span Nominal = 14.35mm
465 – Component Height (Body Height) = 4.65mm
5 – Pins Qty = 5
JEDEC_MO-169AB_D2PAK – Standard Package Name (Added by

Datasheet or Drawing

File Name: TO127P600X120-4_JEDEC_MO-235_NXP_SOT669_LFPAK56_Power-SO8_4_Leads.pdf
File Format: pdf

3D CAD Model - STEP

File Format: STEP

Altium Designer - Footprint

File Name:
File Type: PCB Library (Footprint)
File Format: PcbLib

Altium Designer - Schematic Symbol

File Name:
File Type: Schematic Library (Schematic Symbol)
File Format: SchLib