IPC-7251 Naming Convention for Through-Hole 3D Models and Footprints

The 3D solid electronic modes/footprint (land pattern) naming convention uses component dimensions to describe the 3D electronics model name. The first 3 – 6 characters in the 3D solid model name describe the component kind (3-4 characters), polarity type for capacitors only (non-polarity=Blank/polarity=P), component orientation (axial/radial) and Mounting type (Vertical/Horizontal).

The first number in the 3D model name refers to the Lead Spacing or hole to hole location to insert the component lead. All numbers that follow the Lead Spacing are component dimensions and pin quantity.

These characters are used as component body identifiers that precede the value and this is the priority order of the component body identifiers:

P = Pitch for components with three or more leads
W = Maximum Lead Width or Diameter
L = Body Length for horizontal mounting
D = Body Diameter for round component body
T = Body Thickness for rectangular component body
H = Height for vertically mounted components
Q = Pin Quantity for components with three or more leads
R = Number of Rows for connectors

A, B & C = the fabrication complexity level as defined in the IPC-2221 and IPC-2222

Notes: All component body values are in millimeters and go two places to the right of the decimal point and no leading zero.

CAPAD – Capacitors, Non Polarized Axial Diameter Horizontal Mounting

CAPAD + Lead Spacing + W Lead Width + L Body Length + D Body Diameter

CAPADV – Capacitors, Non Polarized Axial Diameter Vertical Mounting

CAPADV + Lead Spacing + W Lead Width + L Body Length + D Body Diameter

CAPAR – Capacitors, Non Polarized Axial Rectangular Horizontal Mounting

CAPAR + Lead Spacing + W Lead Width + L Body Length + T Body thickness + H Body Height

CAPARV – Capacitors, Non Polarized Axial Rectangular Vertical Mounting

CAPARV + Lead Spacing + W Lead Width + L Body Length + T Body Thickness + H Body Height

CAPRD –   Capacitors, Non Polarized Radial Diameter

CAPRD + Lead Spacing + W Lead Width + D Body Diameter + H Body Height

CAPRR –   Capacitors, Non Polarized Radial Rectangular Vertical Mounting

CAPRR + Lead Spacing + W Lead Width + L Body Length + T Body thickness + H Body Height

CAPRB –   Capacitors, Non Polarized Radial Disk Button Vertical Mounting

CAPRB + Lead Spacing + W Lead Width + L Body Length + T Body thickness + H Body Height


 

CAPPA – Capacitors, Polarized Axial Diameter Horizontal Mounting

CAPPA + Lead Spacing + W Lead Width + L Body Length + D Body Diameter

CAPPRD –   Capacitors, Polarized Radial Diameter Vertical Mounting

CAPPRD + Lead Spacing + W Lead Width + D Body Diameter + H Body Height + V – Height from PCB – Lead Length

CAPPRD –   Capacitors, Polarized Radial Diameter Horizontal Bent Left Mounting

CAPPRD + Lead Spacing + W Lead Width + D Body Diameter + H Body Height + HL – Height from PCB – Lead Length – Lead Bent

CAPPR –   Capacitors, Polarized Radial Diameter Horizontal Bent Right Mounting

CAPPR + Lead Spacing + W Lead Width + D Body Diameter + H Body Height + HR – Height from PCB – Lead Length – Lead Bent

CAPRR –   Capacitors, Non Polarized Radial Rectangular Vertical Mounting

CAPRR + Lead Spacing + W Lead Width + L Body Length + T Body thickness + H Body Height – Lead Length

DIOAD –  Diode, Axial Diameter Horizontal Mounting

DIOAD + Lead Spacing + W Lead Width + L Body Length + D Body Diameter

DIOADV – Diode, Axial Diameter Vertical Mounting

DIOADV + Lead Spacing + W Lead Width + L Body Length + D Body Diameter

DIP – Dual-In-Line Package

DIP + Lead Span + W Lead Width + P Pin Pitch + L Body Length + H Component Height + Q Pin Qty

DIPS – Dual-In-Line Socket

DIPS + Lead Span + W Lead Width + P Pin Pitch + L Body Length + H Component Height + Q Pin Qty

FUSAD –  Fuses, Axial Diameter Horizontal Mounting

FUSAD + Lead Spacing + W Lead Width + L Body Length + D Body Diameter

FUSRR –   Fuses, Radial Rectangular Vertical Mounting

FUSRR + Lead Spacing + W Lead Width + L Body Length + T Body thickness + H Body Height

HDRV – Header, Vertical

HDRV + total Pins + W Lead Width + P Row Pitch (+ X Column Pitch [if different]) + _ Row s + X Pins per Row + _ Body Length + X Body Thickness + X Component Height

HDRRA – Header, Right Angle

HDRRA + total Pins + W Lead Width + P Row Pitch (+ X Column Pitch [if different]) + _ Row s + X Pins per Row + _ Body Length + X Body Thickness + X Component Height

INDAD –   Inductors, Axial Diameter Horizontal Mounting

INDAD + Lead Spacing + W Lead Width + L Body Length + D Body Diameter

INDADV – Inductors, Axial Diameter Vertical Mounting

INDADV + Lead Spacing + W Lead Width + L Body Length + D Body Diameter

INDRD – Inductors, Radial Diameter Vertical Mounting

INDRD + Lead Spacing + W Lead Width + D Body Diameter + H Body Height – Lead Length


 

LEDRD – LEDs, Radial Diameter Vertical Mounting

LEDRD + Lead Spacing + W Lead Width + D Body Diameter + H Body Height

PGA – Pin Grid Array’s

PGA + Pin Qty + P Pitch + C Pin Columns + R Pin Rows + L Body Length X Body Width + H Component Height

RESAD –  Resistors, Axial Diameter Horizontal Mounting

RESAD + Lead Spacing + W Lead Width + L Body Length + D Body Diameter

RESADV – Resistors, Axial Diameter Vertical Mounting

RESADV + Lead Spacing + W Lead Width + L Body Length + D Body Diameter

RESAR – Resistors, Axial Rectangular Horizontal Mounting

RESAR + Lead Spacing + W Lead Width + L Body Length + T Body thickness + H Body Height

RESARV – Resistors, Axial Rectangular Vertical Mounting

RESARV + Lead Spacing + W Lead Width + L Body Length + T Body Thickness + H Body Height – Height from PCB – Lead Length – Height

SIP – Single-In-Line Packages (Resistors)

SIP + Body Width + W Lead Width + P Pin Pitch + L Body Length + H Component Height + Q Pin Qty

JUMP – Jumpers, Wire

JUMP + Lead Spacing + W Lead Width

OSC – Oscillators

OSC + Lead Span + W Lead Diameter + P Pin Pitch + L Body Length + H Component Height + Q Pin Qty

Naming Convention for Non Standard Through-Hole 3D Models and Footprints

Through-hole devices (THD), which package outlines, do not belonging to IPC7352 standard are classified in Non-Standard THD packages.

All Non-Standard Through-hole outline packages are divided in component categories by electrical component types (e.g. Amplifiers, Crystals, LEDs…).

Naming Convention for Non Standard THD 3D models and land patterns (footprints) in most cases consists of abbreviation for electrical component type:

(e.g. AMP, XTAL, LED…) + _ (underscore) + Manufacturer + _ (underscore) + Manufacturer’s Part Number (Manufacturer’s Code).

Non-Standard THD category list is shown below.

Note: All dimensions are in Metric Units and all numbers go two places past the decimal point.

Amplifier
AMP_Manufacturer_Manufacturer’s Code
Battery
BAT_Manufacturer_Manufacturer’s Code
Bridge Rectifier
DIOB_Manufacturer_Manufacturer’s Code
Converter
CONV_Manufacturer_Manufacturer’s Code
Crystal
XTAL_Manufacturer_Manufacturer’s Code
Ferrite Bead
FB_Manufacturer_Manufacturer’s Code
Filter
FIL_Manufacturer_Manufacturer’s Code
Fuse
FUSE_Manufacturer_Manufacturer’s Code
Fuses, Resettable
FUSER_Manufacturer_Manufacturer’s Code
Heat Sinks
HSINK_Manufacturer_Manufacturer’s Code
Inductor
IND_Manufacturer_Manufacturer’s Code
LED
LED_Manufacturer_Manufacturer’s Code
Liquid Crystal Display
LCD_Manufacturer_Manufacturer’s Code
Microphone
MIC_Manufacturer_Manufacturer’s Code
Metal Oxide Varistor
MOV_Manufacturer_Manufacturer’s Code
Opto Isolator
OPTO_Manufacturer_Manufacturer’s Code
Oscillator
OSC_Manufacturer_Manufacturer’s Code
PAD
PAD + Pad Size X Hole Size + H
Photo Detector
PHODET_Manufacturer_Manufacturer’s Code
Regulator
REG_Manufacturer_Manufacturer’s Code
Relay
RELAY_Manufacturer_Manufacturer’s Code
Shield, off the shelf
SHIELD_Manufacturer_Manufacturer’s Code
Shield, Custom
SHIELD + Body Length X Body Width
Speaker
SPKR_Manufacturer_Manufacturer’s Code
Stiffner
STIF_Manufacturer_Manufacturer’s Code
Switch
SW_Manufacturer_Manufacturer’s Code
Thermistor
THERM_Manufacturer_Manufacturer’s Code
Transducers, Infrared Detection and Acquisition (IRDA)
XDCR_Manufacturer_Manufacturer’s Code
Transient Voltage Suppressor
TV_Manufacturer_Manufacturer’s Code
Transient Voltage Suppressor, Polarized
TVS_Manufacturer_Manufacturer’s Code
Transistor Outlines and Voltage Regulator (JEDEC Standard Package)
TO-JEDEC Standard Code
Transistor Outlines, Custom
TRANS_Manufacturer_Manufacturer’s Code
Transformer
XFMR_Manufacturer_Manufacturer’s Code
Trimmer and Potentiometer
TRIM_Manufacturer_Manufacturer’s Code
Tuner
TUNER_Manufacturer_Manufacturer’s Code
Varistor
VAR_Manufacturer_Manufacturer’s Code

Tutorials in the category: IPC Standards

  • How to calculate PTH hole and pad diameter sizes according to IPC-7251, IPC-2222 and IPC-2221 standards?
  • IPC-7251 Naming Convention for Through-Hole 3D Models and Footprints
  • IPC-7351B Naming Convention for Surface Mount Device 3D Models and Footprints
  • IPC-7X51 Naming Convention for Connectors and Mechanical Components
  • Naming Convention for Non Standard Surface Mount Device 3D Models and Footprints