IPC-7351B Naming Convention for Surface Mount Device 3D Models and Footprints
The 3D CAD solid electronic modes/footprint (land pattern) naming convention uses component dimensions to describe the 3D electronics part name.
The first 3 – 7 characters in the 3D solid model name describe the component kind. Metric Units are used for all dimensions.
Body Sizes and Lead Span go two places before the decimal point and “remove” leading Zeros. Body Sizes of Chip Components are one place to each side of the decimal point. Pitch Values are two places to the left & right of decimal point and include trailing zeros but with no leading Zeros.
These characters in model name are used as:
P = Pitch for components
X = is used to separate two Body Dimensions (for example Body Height X Body Width X Height)
_ = is the separator between pin quantity in Deleted & Hidden pin
– = is used to separate the pin quantity.
C = Collapsing Balls (only for BGA)
N = Non-collapsing Balls (only for BGA)
BGA – Ball Grid Array’s
BGA + Pin Qty + C or N + Pitch P + Ball Columns X Ball Rows _Body Length X Body Width X Height
BGA – Ball Grid Array’s w/Dual Pitch
BGA + Pin Qty + C or N + Col Pitch X Row Pitch P + Ball Columns X Ball Rows _Body Length X Body Width X Height
BGAS – Ball Grid Array’s w/Staggered Pins
BGAS + Pin Qty + C or N + Pitch P + Ball Columns X Ball Rows _Body Length X Body Width X Height
CAPCAV – Capacitors, Chip, Array, Concave
CAPCAV + Pitch P + Body Length X Body Width X Height -Pin Qty
CAPCAF – Capacitors, Chip, Array, Flat
CAPCAF + Pitch P+ Body Length X Body Width X Height -Pin Qty
CAPC – Capacitors, Chip, Non-polarized
CAPC + Body Length + Body Width X Height
CAPCP – Capacitors, Chip, Polarized
CAPCP + Body Length + Body Width X Height
CAPCWR – Capacitors, Chip, Wire Rectangle
CAPCWR + Body Length + Body Width X Height
CAPM – Capacitors, Molded, Non-polarized
CAPM + Body Length + Body Width X Height
CAPMP – Capacitors, Molded, Polarized
CAPMP + Body Length + Body Width X Height
CAPAE – Capacitors, Aluminum Electrolytic
CAPAE + Base Body Size X Height
CFP127P – Ceramic Flat Packages, 1.27mm Pitch
CFP127P + Lead Span Nominal X Height – Pin Qty
CGA – Column Grid Array’s
CGA + Pitch P + Number of Pin Columns X Number of Pin Rows X Height – Pin Qty
XTAL – Crystals (2 leads)
XTAL + Body Length X Body Width X Height
DIP – Dual-in-Line Packages (Butt Mount)
DIP + Pitch P + Lead Span Nominal X Height – Pin Qty
DFN – Dual Flat No-lead
DFN+ Body Length X Body Width X Height – Pin Qty
DIOC – Diodes, Chip
DIOC + Body Length + Body Width X Height
DIOM – Diodes, Molded
DIOM + Body Length + Body Width X Height
DIOMELF – Diodes, metal electrode leadless face (MELF)
DIOMELF + Body Length + Body Diameter
DIOSC – Diodes, Side Concave
DIOSC + Body Length X Body Width X Height -Pin Qty
FUSM – Fuses, Molded
FUSM + Body Length + Body Width X Height
INDC – Inductors, Chip
INDC + Body Length + Body Width X Height
INDM – Inductors, Molded
INDM + Body Length + Body Width X Height
INDP – Inductors, Precision Wire Wound
INDP + Body Length + Body Width X Height
INDCAV – Inductors, Chip, Array, Concave
INDCAV + Pitch P+ Body Length X Body Width X Height – Pin Qty
INDCAF – Inductors, Chip, Array, Flat
INDCAF + Pitch P + Body Length X Body Width X Height -Pin Qty
LGA – Land Grid Array, Circular Lead
LGA + Pin Qty + C + Pitch P + Pin Columns X Pin Rows _Body Length X Body Width X Height
LGA – Land Grid Array, Square Lead
LGA + Pin Qty + S + Pitch P + Pin Columns X Pin Rows _Body Length X Body Width X Height
LGA – Land Grid Array, Rectangle Lead
LGA + Pin Qty + R + Pitch P + Pin Columns X Pin Rows _Body Length X Body Width X Height
LEDM – LED, Molded
LEDM + Body Length + Body Width X Height
LEDSC – LED’s, Side Concave
LEDSC + Body Length X Body Width X Height -Pin Qty
OSCSC – Oscillators, Side Concave
OSCSC + Pitch P + Body Length X Body Width X Height -Pin Qty
OSCJ – Oscillators, J-Lead
OSCJ + Pitch P + Body Length X Body Width X Height -Pin Qty
OSCL – Oscillators, L-Bend Lead
OSCL + Pitch P + Body Length X Body Width X Height -Pin Qty
OSCCC – Oscillators, Corner Concave
OSCCC + Body Length X Body Width X Height
PLCC – Plastic Leaded Chip Carriers
PLCC + Pitch P + Lead Span L1 X Lead Span L2 Nominal X Height -Pin Qty
PLCCS – Plastic Leaded Chip Carrier Sockets Square
PLCCS + Pitch P + Lead Span L1 X Lead Span L2 Nominal X Height -Pin Qty
QFP – Quad Flat Packages (Pitch = 0.65mm, 0.80mm or 1.00mm; Height > 1.6mm)
QFP + Pitch P + Lead Span L1 X Lead Span L2 Nominal X Height -Pin Qty
SQFP – Shrink Quad Flat Packages (Pitch = 0.30mm, 0.40mm or 0.50mm; Height > 1.6mm)
SQFP + Pitch P + Lead Span L1 X Lead Span L2 Nominal X Height -Pin Qty
TQFP – Thin Quad Flat Packages (Pitch = 0.65mm or 0.80mm; Height ≤ 1.6mm)
TQFP + Pitch P + Lead Span L1 X Lead Span L2 Nominal X Height -Pin Qty
TSQFP – Thin Shrink Quad Flat Packages (Pitch = 0.30mm, 0.40mm or 0.50mm; Height ≤ 1.6mm)
TSQFP + Pitch P + Lead Span L1 X Lead Span L2 Nominal X Height -Pin Qty
CQFP – Ceramic Quad Flat Packages
CQFP + Pitch P + Lead Span L1 X Lead Span L2 Nominal X Height -Pin Qty
QFN – Quad Flat No-lead
QFN + Pitch P + Body Width X Body Length X Height -Pin Qty + Thermal Pad
PQFN – Pull-back Quad Flat No-lead
PQFN + Pitch P + Body Width X Body Length X Height – Pin Qty + Thermal Pad
LCC – Quad Leadless Ceramic Chip Carriers
LCC + Pitch P + Body Width X Body Length X Height – Pin Qty
LCCS – Quad Leadless Ceramic Chip Carriers (Pin 1 on Side)
LCCS + Pitch P + Body Width X Body Length X Height – Pin Qty
RESC – Resistors, Chip
RESC + Body Length + Body Width X Height
RESM – Resistors, Molded
RESM + Body Length + Body Width X Height
RESMELF – Resistors, MELF
RESMELF + Body Length + Body Diameter
Resistors, Chip, Array, Concave
RESCAV + Pitch P + Body Length X Body Width X Height -Pin Qty
RESCAXE – Resistors, Chip, Array, Convex, E-Version (Even Pin Size)
RESCAXE + Pitch P + Body Length X Body Width X Height -Pin Qty
RESCAXS – Resistors, Chip, Array, Convex, S-Version (Side Pins Diff)
RESCAXS + Pitch P + Body Length X Body Width X Height -Pin Qty
RESCAF – Resistors, Chip, Array, Flat
RESCAF + Pitch P + Body Length X Body Width X Height -Pin Qty
SODFL – Small Outline Diodes, Flat Lead
SODFL + Lead Span Nominal + Body Width X Height
SOJ – Small Outline IC, J-Leaded
SOJ + Pitch P + Lead Span Nominal X Height – Pin Qty
SOIC127P – Small Outline Integrated Circuit, (50 mil (1.27mm) Pitch SOIC)
SOIC127P + Lead Span Nominal X Height – Pin Qty
SOP – Small Outline Packages (Pitch = 0.635mm, 0.65mm, 0.80mm, 1.00mm or 1.27mm; Height > 1.6mm)
SOP + Pitch P + Lead Span Nominal X Height – Pin Qty
SSOP – Shrink Small Outline Packages (Pitch = 0.30mm, 0.40mm or 0.50mm; Height > 1.6mm)
SSOP + Pitch P + Lead Span Nominal X Height – Pin Qty
TSOP – Thin Small Outline Packages (Pitch = 0.65mm, 0.80mm, 1.00mm or 1.27mm; Height ≤ 1.6mm)
TSOP + Pitch P + Lead Span Nominal X Height – Pin Qty
TSSOP – Thin Shrink Small Outline Packages (Pitch = 0.30mm, 0.40mm, 0.50mm or 0.55mm; Height ≤ 1.6mm)
TSSOP + Pitch P + Lead Span Nominal X Height – Pin Qty
SON – Small Outline No-lead
SON + Pitch P + Body Width X Body Length X Height – Pin Qty + Thermal Pad
PSON – Pull-back Small Outline No-lead
PSON + Pitch P + Body Width X Body Length X Height – Pin Qty + Thermal Pad
SOTFL – Small Outline Transistors, Flat Lead
SOTFL + Pitch P + Lead Span Nominal X Height – Pin Qty
SOD (JEDEC)
SOD + Lead Span Nominal + Body Width X Height
SOT143 & SOT343 (JEDEC Standard Package)
SOT + Pitch P + Lead Span Nominal X Height – Pin Qty
SOT143 & SOT343 Reverse (JEDEC Standard Package)
SOT + Pitch P + Lead Span Nominal X Height – Pin Qty
SOT23 Packages
SOT + Pitch P + Lead Span Nominal X Height – Pin Qty
SOT223 Packages
SOT + Pitch P + Lead Span Nominal X Height – Pin Qty
SOT89 (JEDEC Standard Package)
SOTFL + Pitch P + Lead Span Nominal X Height – Pin Qty
SOT89
SOTFL + Pitch P + Lead Span Nominal X Height – Pin Qty
TO (Generic DPAK, D2PAK)
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