Shipment and handling package types
List of methods for shipment and handling packages of surface mount devices (SMD) and some through-hole devices (THD) are:
Tape and Reel
The most used method for shipment and handling SMD packages is Tape and Reel.It is used for shipment of almost all SMD packages such as: CHIP, BGA, SOIC, SOP, QFN , QFP, SOT etc.
Standard Tape and Reel width Dimensions are 8mm, 12mm, 16mm, 24mm, 32mm, 44m, 56mm.
Standard Tape and Reel Diameter (Size) Dimensions are 178mm (7 inches), 330mm (13 inches), 360mm (14.173 inches).
Picture 1: Tape and Reel Package
Tubes (also called stick magazines) are one of the first types of shipment packages. They are used for both SMD and THD components.
Picture 2: Tube Package
Trays are used for shipment and handling SMD packages. Tray’s advantage in regards to tube packages is that they protect balls and leads from mechanical and electrical damage.
Standard Tray Dimension by JEDEC is 322.6 x 136mm (12.7 x 5.35 inches)
There are 2 standard JEDEC tray thicknesses:
1. Low profile of 6.35mm (0.25 inch) suitable for BGA, CSP, QFP, TQFP, SQFP, TSQFP, QFN, SOP, TSOP, TSSOP and SOIC
2. High profile of 10.16mm (0.4 inch) suitable for CERAMIC QUAD, PGA, and PLCC
Picture 3: Tray Package
It is widely used for some through-hole components.
Picture 4: Bulk Package
Die and Wafer
Wafer is a slice of semiconductor material, such as silicon crystal. It is used for production of semiconductor devices and integrated circuits.
Picture 3: Die and Wafer
Useful links of Tape and Reel Specifications by Manufacturers
Useful links of Tape and Reel Specifications by Manufacturers are listed below:
Useful links of Packing Methodology
Useful links of Packing Methodology published by:
Tutorials in the category: PCB Design